Meet a New Wireless DashDrive Air AE800 External Drive from Adata

Adata is glad to announce the release of its newest universal device – Adata DashDrive Air AE800 wireless external drive. The greenhorn combines a few advanced features that bring the communication with various devices to a higher level. First of all, the AE800 comes in 500 GB capacity, which is quite enough for storing of large amount of data. Secondly, the drive is housed in an elegant case that would find its place in any environment.

Thirdly, this device is equipped with a high-speed USB 3.0 interface for a smooth data transfer process. Fourthly, DashDrive Air AE800 comes with a dedicated lithium-pol battery (5200 mAh capacity). It is used as a charge-in device for external mobile devices. The connection of those devices to the drive is realized via an onboard USB AF port.

To continue, thanks to the availability of an integrated Wi-Fi module (802.11b/g/n), the drive is able to operate as a wireless access point. The maximal amount of permissible online users …

Graphics Card MSI N650 Ti PE 1GD5/OC Review

PC hardware of average price category is traditionally in demand with a wide range of customers. Graphics cards are not exception, especially if the manufacturers offer truly outstanding facilities for comparatively medium price. The launch of GeForce GTX 650 Ti adapter raised an army of graphics solutions based on it; still, each company tries to deviate in some terms from the reference model. Thus, MSI introduced N650 Ti Power Edition 1GD5/OC model which takes GTX 650 Ti adapter as the basis, but employs fundamentally original printed circuit board and cooling system.


Graphics card MSI N650 Ti PE 1GD5/OC features all attributes ascribed to Power Edition series. Printed circuit board has been elongated to 230 mm, as compared to the 154 mm in reference GeForce GTX 650 models. Along with the PCB elongation, MSI implemented a reinforced 5-phase VRM scheme (4+1) that is intended at operational intensification on heightened frequencies. The connection of additional …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 08 April 2012, 20:52
Last visit: 08 April 2012, 20:52