VIA Announces the Upcoming Release of VAB-800 Motherboard

VIA Technologies Inc., a global manufacturer of power-efficient processor platforms, has recently announced the release of its peculiar motherboard, codenamed VAB-800. The major peculiarity of these motherboards is that they will be delivered in two variants: with chips of VIA personal production, WonderMedia (800 MHz), and with Freescale ARM Cortex-A8 1 GHz chips. The volume capacities of DDR3 memory in either variant will equal to 1 GB. VAB-800 is developed in piro-ITX form-factor but is also compatible with blocks of ATX form-factor.

Motherboard VAB-800 accommodates flash-memory of eMMC type with the integrated SATA 3 Gbit/sec sockets. The total volume capacity of flash-memory equals to 64 GB. This model can boast a large number of internal sockets, including a couple of RS-232, two LVDS (to enable the connection with the up-to-date monitors), SATA, JTAG, SDIO, RTC, and a slot for the activation of the external power supply.

The manufacturer has taken care of the …

ASRock Unveils Z170M OC Formula Mainboard

ASRock came into the market with a new small-sized overclocking-oriented mainboard. Entitled Z170M OC Formula, the model is designed in micro-ATX form-factor on the basis of Intel Z170 chipset. The latter is ready to cooperate with Intel Skylake CPUs for Socket LGA1151. The PCB offers a pair of DIMM slots for DDR4-4500 MHz RAM (up to 32 GB capacity).

ASRock Z170M OC Formula accommodates three PCIe 3.0 x16 expansion slots, enabling the creation of various graphics configurations (including Nvidia SLI & AMD CrossFireX). Storage subsystem is introduced by a pair of SATA Express ports (10 Gb/sec) as well as four SATA ports (6 Gb/sec) and one Ultra M.2 slot (32 Gb/sec).

This motherboard boasts a high-quality audio subsystem; it is based on Realtek ALC1150 controller, generating 7.1-channel sounding (Purity Sound 3). The 10-layer PCB comes with an integrated 14-phase power subsystem with dual-stack MOSFETs, premium choke coils, and solid-state capacitors Nichicon 12K Platinum. …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 14 April 2011, 09:01
Last visit: 14 April 2011, 09:23