Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Computer Case be quiet! Silent Base 600 Overview (Part II)

Internal structure

The motherboard compartment is located above the power supply unit. In this regard, everything is quite standard for a Mid Tower class. A large cutout is made in a tray behind a CPU socket, to allow installation of a CPU cooling system directly into the case; a backplate mount (thrust-pad located on the back side of the motherboard) is used for this purpose.


The four large slots in a tray, equipped with the silicone membrane, are designed for proper cable management which looks very promising here. Plugs of expansion slots are attached by thumbscrews. The front part holds a hard disks’ basket for three drives.


At the back side a slot in a tray can be clearly seen to access cable management system slot. Also, the rear side contains two tool kits for installation of solid-state drives and size 2.5" hard disks.


The side cover is made of 0.7 mm steel, and from the inside has a thick vibration and noise absorbing coating. The recess in the …

Silicon Power Amplifies Its SSD Line with Slim S50 Series

Silicon Power, a renowned Taiwanese designer of various storage solutions, amplifies its solid-state drives line with a new series, entitled Slim S50. This series is introduced by four models of 32GB, 64GB, 128GB, and 256GB capacity. All of them are housed in a really slim black casing (7mm) that owns vibration-proof and shock-proof properties. The drives are characterized by the employment of a high-speed SATA III 6Gb/sec interface.



Whatever the model is under consideration, Slim S50 drives demonstrate compatibility with PCs of various form-factor, including the most advanced and compact ultrabooks. Along with the exponential physical properties, these SSDs are ready to provide the customers with a stable and utmost performance.


Thus, the maximal sequential reading speed equals to 530Mb/sec, while the speed on sequential writing speed approximates 200Mb/sec. Unfortunately, Silicon Power does not specify the showings on random Read/Write operations; there is also no …
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Registered at: 28 November 2011, 08:19
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