Thermaltake Enters the Market with NiC L31 and L32 CPU Coolers

Thermaltake Technology has just started shipping a pair of budgetary CPU coolers from NiC series. Entitled NiC L31 and NiC L32, these two models are compatible with all updated Intel and AMD platform motherboards. In keeping with the manufacturer, the new-comers will not obstruct the mounting of memory modules, due to their well-considered framework. Hence, they consist of small-sized heatsinks, three U-shape heatpipes (8 mm), and a base that is in direct contact with the CPU.



The first model, NiC L31 (codename: CL-P001-AL12RE-A), features 140x128x40 mm dimensions and weighs 530 g. The integrated 120 mm fan might operate in various speed modes – from 500 RPM to 1800 RPM – thanks to the support for PWM technology. It produces up to 70.99 CFM and dissipates up to 160 W power.


At the same time, at the minimal speed mode it generates only 18 dB noise, however at the ultimate rotations this index rises to 34.8 dB. According to the results of multiple tests, this fan is …

Overview of the ASUS Prime X370-Pro Motherboard

Four- and six-core models of Ryzen 5 Summit Ridge processors have already appeared on sale, and almost everything is known about the speed and overclocking potential of the eight-core models (R7). The new Ryzen series processors are actually system-on-a-chip (SOC). Integration of the memory controller, functions of which have been once performed by the north bridge, is not something surprising.


Much more interesting is the south bridge, responsible for working with the periphery. Now such processors have basic capabilities for connecting, for example, drives, and they also have several USB outputs. In other words, most of the functions of motherboards have now lost their habitual form.


The so-called «chipset» is a hub; it greatly extends the capabilities of the computer. In fact, those fixes that many users expect are in the plane of UEFI interaction with the CPU (SOC) itself and are unlikely to rest on the structural component of the board.


AMD X370 is the senior …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 03 June 2012, 02:14
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