ARM Readies Cortex-A72 and Mali-T880 for Mobile Devices

ARM has just announced a series of solutions for the upcoming next-generation mobile SoC. The most notable developments are Cortex-A72 processor and Mali-T880 graphics. According to the manufacturer, both components will be interconnected within SoC by means of CoreLink – CCI-500. The launch of new items is scheduled for 2016. Rockchip, MediaTek and HiSilicon are among the companies to integrate both elaborations into their products.



It should be noted that Cortex- A72 is a successor of Cortex-A57, taking analogous 64-bit operations but demonstrating three times higher performance. The new-comer will be designed under 16 nm FinFET+ technological process. Its layout corresponds to big.LITTLE framework requirements; this promotes for its combination with other ARM cores.


As far as Mali-T880 GPU is concerned, it provides for 1.8 response time increase if compared with the Mali-T760 model. Herewith, its power consumption is reduced by 40%. Moreover, this GPU might support 4K …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …
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