The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.

The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.

The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.

Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

Air Cooler Thermalright Archon SB-E Review

Thermalright Inc. has managed to design and supply a whole galaxy of cooling solutions for the entire period of its existence. The prototype of the cooler codenamed Thermalright Archon SB-E was announced last spring and its original version has reached the market this autumn. This model is characterized by some outstanding efficiency and noise level showings, as well as high compatibility with diverse platforms.

General Peculiarities

This air cooler is delivered in a traditional for this manufacturer cardbox. The box contains the cooler itself and a set of key components, featuring a universal backplate, a set of screws, a screwer, fan frames, and brand thermal compound — Thermalright The ChillFactor III. Archon SB-E features 175x155x79.5 mm dimensions and weighs 940 g. It is compatible with Intel and AMD platforms and supports sockets LGA 775/1155/1156/1366/2011 (Intel) and 939/FM1/FM2/AM2/AM2+/AM3/AM3+ (AMD).


The implemented heatsink accommodates …

Evga Launches One More Overclocked Graphics Card

Evga, a leading American supplier of 3D cards, is going to launch one more graphics card with factory overclocked speeds. A new model is based on Nvidia FeForce GTX 670 adapter and codenamed as Evga GeForce GTX 670 FTW LE. Its design resembles the one implemented in GeForce GTX 670 FTW card, but the main distinction between them is seen in frequency showings. The newbie demonstrates a bit lower frequency index than its predecessor.

Evga GeForce GTX 670 FTW LE is housed on a PCB designed for PCI-e 3.0 x16 bus. This card takes GK104 graphics core with 1344 CUDA cores as the basis; it is developed on Kepler architecture under 28 nm standards. Its inventory also embraces 2GB of GDDR5 memory (256-bit interface). Cooling system is introduced by a 2-slot cooler of active type with a single turbine-like fan. Power subsystem consists of two connection 6-pin sockets and requires a quite efficient PSU (not less than 500W power).

Frequency template looks the following way: GPU runs at …
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Registered at: 10 April 2011, 23:23
Last visit: 10 April 2011, 23:23