Biostar Intros Hi-Fi A85W 3D Motherboard with a Bunch of Useful Features

Biostar, has recently introduced a new Hi-Fi A85W 3D motherboard, intended to support APUs from AMD for Socket FM2 (Richland and Trinity generation APUs). The board is developed in ATX form-factor and features four DIMM slots for DDR3 memory modules. Expansion facilities are guaranteed by two PCI slots, two PCI Express x16 2.0 slots, and PCI Express x1 2.0 slots, while connectivity options are secured by eight SATA III ports with the support of various RAID configurations (RAID 0, 1, 5, 10). The model also boasts three video sockets (VGA, DVI and HDMI) and USB 3.0 ports.



Biostar Hi-Fi A85W 3D is able to offer customers a lot of useful features. Hence, it employs 24-bit sampling that ensures the production of utmost sounding via analogue interface, while connecting with home theaters, multi-channel acoustic systems and high-efficiency headphones. Multi-channel Calibration (MCC) technology allows for the adjusting of an optimal sound environment on different spacing. With the …

Deepcool Debuts with the First Mid-Tower Case Entitled Pangu

Deepcool has been producing high-efficiency cooling solutions for many years in a row. Nonetheless, the company decided to expand its production line with PC cases. Deepcool Pangu is the first company’s elaboration in this segment. It is developed in a mid-tower form-factor and comes in two color variations – black and white. Upon the whole, the case features an unpretentious design, but is ready to amaze every user by internal layout.



Therefore, Pangu is predestined for ATX and micro-ATX motherboards, as well as for ATX-compatible PSUs. It accommodates seven PCI Express expansion slots, three mounting seats for 5.25-inch drives, and a couple of removable baskets for the installation of up to six drives (either 3.5-inch or 2.5-inch standard). Mounting process does not require the involvement of any special tools.


Deepcool Pangu boasts the availability of multiple bays for fans fixture. There are two mounting seats for 120 mm fans in the frontal part of the chassis. If …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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