Xigmatek Manifests Specifications of Apache III

Xigmatek, a Taiwanese manufacturer of PC cooling solutions, has just promulgated the specifications of its new cooler series entitled Apache III. The series consists of two models only, which differentiate themselves by the casing's material and color. Model CD901 is housed in a silver aluminum casing, while model CD903 – in a black anodized aluminum casing. Both models have been developed specifically for CPU cooling purposes; they are able to support various platforms offered by Intel and AMD: LGA 775, 1155, 1156 (Intel), Socket AM2 and later (AMD).

Both models in Apache III series are equipped with a voluminous aluminum heatsink and 92 mm fan with half-transparent orange ribs. The fan is based on Long Life bearing and features PWM facility that allows for the adjustment of fan rotational speed. The speed span variates between 1200-2500 rpm, depending on the CPU temperature and loading. The noise level does not outreach the measures of twenty dB.

Cooling system Apache …

New Motherboard from Gigabyte with Ultra Durable 4 Classic Design

Gigabyte has recently introduced a new motherboard intended specifically for the creation of budgetary entry-level systems. Codenamed Gigabyte GA-H61M-USB3H, the model is developed in micro-ATX form-factor and features 226x174 mm dimensions. Chipset Intel H61 Express secures all key functions of the board, while the support of Socket LGA1155 empowers the incorporation of CPUs based on Intel Ivy Bridge and Intel Sandy Bridge architecture.

GA-H61M-USB3H features only two 240-contact DIMM slots for the installation of up to 16 GB of DDR3-1333 MHz memory. Video subsystem might have dual nature: it might either employ an integrated into CPU graphics core or use an independent graphics card with PCI Express 3.0 x16 internal interface. Audio subsystem is represented by Realtek ALC887 controller which secures 7.1-channel sounding. Network facilities are ensured by 1x gigabit network controller powered by Realtek.

The connection of external displays is realized via three video …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 04 October 2012, 12:50
Last visit: 04 October 2012, 12:50