AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …

MSI Offers H87I AC Motherboard for Demanding PC Builders

MSI has made a pleasing presentation for all builders and enthusiasts who would like to create a small-sized but highly efficient gaming or multimedia system. The MSI H87I AC is designed in mini-ITX form-factor, featuring 170x170 mm dimensions only. The core of the board is Intel H87 Express chipset that supports all Haswell CPUs with LGA1150 socket. According to the latest data, the model is already available in the European market for approximately 102 EUR.



The H87I AC accommodates two DIMM slots, available for the incorporation of DDR3 modules with the maximal frequency of 1600 MHz. The latter might work in a two-channel mode and reach 16 GB capacity. Disk subsystem is organized by means of four SATA III 6 Gb/sec ports, which allow for the creation of diverse RAID configurations (i.e. 0, 1, 5, 10, AHCI).


Expansion is realized due to a single PCI-e 3.0 x16 connector and one mini-PCI-e (half-size) connector for network modules. Network abilities are supported by one …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …
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Registered at: 01 August 2012, 09:20
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