Oval CPU Cooler Xigmatek Colosseum SM128164 Review

Rivalry in the CPU cooling market is rather tough nowadays. Each and every manufacturer tries to exceed its competitors by elaborating high-performance and durable coolers. Some companies pay attention primarily to efficiency, while the others try to draw potential audience by an unusual design. Xigmatek, a renowned manufacturer in this segment, has been introducing qualitative and original solutions for many years. Its Colosseum SM128164 is a vindication of the assumptions that unusual in design coolers can be efficient. Let’s have a look at it.



Design and Framework


The Xigmatek Colosseum SM128164 at the first sight looks as an ordinary cooler of a rectangular form with the height of 157 mm. It consists of a heatsink block, a fan, a mirror-like base, and five heat pipes. The central pipe is larger than the other four: its diameter equals to 8 mm, whereas the side pipes feature 6 mm diameter. Nonetheless, if turning the cooler sideways, it becomes vivid that the item is a …

Akasa Intros Low-Profile CPU Cooler Nero LX

Akasa, a global manufacturer of chassis, PSUs, and PC peripheral components, introduces its new low-profile cooling system, codenamed Nero LX. The new product is intended specifically to provide the maximal cooling effect to CPU and its surrounding elements. Nero LX might be employed in HTPC and slimmer PC systems. Detailed specifications about this cooler have just appeared at the manufacturer's official website, however pricing info has not been revealed yet.



Akasa Nero LX features 120x120x59 mm dimensions and weighs 298 g. The overall cooler's framework consists of a 120 mm fan, a large base, and four copper heat pipes that pierce an aluminum heatsink. The cooler employs an advanced scheme of direct contact of heatpipes with CPU surface which promotes for the utmost cooling environment.


This model is compatible with a majority of processor sockets developed by AMD and Intel. Hence, it supports Socket FM1, AM2, AM2+, AM3 from AMD, and LGA 1366, 1156, 1155, and 775 from …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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Registered at: 30 May 2012, 20:33
Last visit: 23 June 2012, 17:22