Cooler Master to Release a New Budgetary Midi-Tower Chassis

New PC chassis from Cooler Master appear in the market with an enviable regularity. Each customer group, starting from entry-level customers and finishing with overclockers, can totally avail themselves with the up-dated facilities provided by the developer. This time, individuals with a quite modest budget will have an opportunity to enjoy all the privileges of contemporary technologies, since Cooler Master is going to release next month a new budgetary PC case of midi-tower form-factor. Codenamed CM Force 500, the case features 491.5x190.426 mm dimensions and is entirely painted black.



Chassis CM Force 500 supports motherboards of ATX and micro-ATX standard, and is ready to welcome all graphics adapters of up to 320 mm in length. Internal framework is estimated for the installation as of air cooling system, so of liquid coolers; hence, the maximal admissible height of the CPU air cooler approximates 164 mm, while dimensions of the heatsink attached to the liquid cooler should …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Akasa Prepares Its Euler for Upcoming Release

Recent global IT exhibition Computex 2012 has given promising prospects for Akasa company that introduced its new brand chassis. Codenamed Euler, this chassis might serve the basis for the noiseless mini-PCs. Due to the implementation of aluminum casing in design and its simultaneous substitute of a radiator, this device is able to function along with passive cooling system.



Akasa representatives have provided the Internet community with the first shots of Euler. Those pictures demonstrate that the future product will consist of a block which will remove the excessive heat from the CPU and its surrounding components. The model will support devices which show up to 35W TDP index. This chassis will be compatible with motherboards of mini-ATX form-factor and low-capacity two-core processors.


According to the words of the company's representatives, Euler is going to be released this September. The price policy has not been voiced so far, but hardware specialists are certain …
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