TUL Takes Up Producing Brand PowerColor Graphics Adapter

TUL Corporation has announced the release of its brand high-performance graphics adapter, codenamed PowerColor Radeon HD 7950 Boost State Edition. The major peculiarity of the new product is the integration of GDDR5 memory type with 384 bit interface and support of multiple advanced technologies.



The model is based on black circuit board with the integrated Tahiti PRO chip, developed under 28 mm technological process. This chip accommodates 1792 current processors designed on Graphics Core Next architecture. This graphics adapter is compatible with PCI Express 3.0 x16 bus and DirectX 11.1 facility. The overall volume capacity of GDDR5 memory equals to 3072 MB. Heat management process is realized due to the two-slot cooling system of active type. The rear panel of the adapter is alloted for HDMI and DVI slots, as well as, for a couple of mini-DisplayPort ports.


The nominal frequency of graphics core equals to 850 MHz; nevertheless, the implementation of AMD PowerTune …

Scythe Showcases Asymmetric Byakko CPU Cooler

Scythe, a well-known Japanese manufacturer of cooling solutions, is about to release an uncommon CPU cooler. Entitled Byakko, the Tower model features an asymmetric design: an aluminum heatsink is superseded backwards against the nickel-plated base; such framework ensures an ideal compatibility of the cooler with high RAM modules. Moreover, the item is only 130-mm high, so it can fit any PC case.



Scythe Byakko is reconcilable with the majority of modern platforms, including Intel Socket LGA 1366/115x/775 & AMD Socket FM1/FM2/FM2+/aM2/AM2+/AM3/AM3+. The cooler accommodates three nickel-plated 6-mm heat pipes, replenished by a single 92-mm fan. The Scythe Slip Stream 92 PWM is based on a sleeve bearing. Thanks to the PWM support, the fan is able to rotate within 300-2300 RPM range. Therewith, the maximal noise level does not surpass the margin of 28.26 dBA (the minimal index is 7.2 dBA).


The model is able to produce 6.70-46.55 CFM airflow, depending on the rotational speed. …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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