Scythe Launches One More Chassis with Austere Design

Many customers know Scythe primarily for its delivery of high-end coolers. Nevertheless, the company is gradually extending its assortment by other PC components. Thus, it decided to launch a new brand PC chassis, codenamed Case by Case 3, that will be distributed initially on the internal market. The model is developed in mid-tower form-factor and features classical austere design. Steel casing is totally painted black (from the inside and outside).

Case by Case 3 is able to accommodate motherboards of ATX and micro-ATX standard. As it was mentioned before, the chassis is characterized by austerity in design and absence of any ornamental elements or distracting insertions in framework. The latter features some dedicated accessories for the screwless drive installation.

Internal layout is also estimated for the integration of power supply units of ATX format, four bays for 5.25-inch drives, seven slots for 3.5-inch hard drives or 2.5-inch SSDs. Additionally, the casing …

OCZ Announces a New Vertex 460 SSD Series

OCZ Storage Solutions, a newbie integral part of Toshiba Group Company, announces the release of a new SSD series, entitled Vertex 460. The series is represented by three 2.5-inch models of 480 GB, 240 GB, and 120 GB capacity. In order to facilitate with the installation and further utilization, the manufacturer equips all drives with a dedicated 3.5-inch adapter, as well as with Acronis True Image HD software package. Moreover, the models are backed by 3-years limited warranty that guarantees durable reliability.

OCZ Vertex 460 drives are based on Toshiba NAND MLC flash chips, elaborated according to 19 nm technological process. All three models employ SATA III 6 Gb/sec interface and are equipped with OCZ Barefoot 3 M10 controller. Thanks to such fusion, these SSDs demonstrate unprecedented performance results, whatever type of data is concerned.

Therefore, an ultimate data Read/Write speed in sequential operations equals to 545/525 MB/sec, whereas in 4 KB random …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 10 July 2012, 14:46
Last visit: 10 July 2012, 14:56