Seven-Port USB 3.0 Hub H7988-U3 from Orico

Chinese company Orico has just voiced good news for all people craving for a comprehensive device which enables numerous USB 3.0 connections. Its new seven-port hub H7988-U3 is able to satisfy the needs of any customer who feels the need for several simultaneous USB 3.0 connections. This is not the first Orico's attempt to produce a really multi-functional device. The company has recently introduced PC expansion chip with PCI Express x1 interface which involved seven ports as well. Analogous functionality has been implemented in a new external hub H7988-U3.

Orico H7988-U3 goes in two color variants (black and white) and is based on VIA VL801 controller. The framework of the hub is rather suitable for the multi-connection operations. All available USB 3.0 ports are located on the side plates: three ports on the frontal plate, and two in each side plates. The rear plate accommodates the switch, USB 3.0 port to be connected with PC, and input to be connected with the power network …

Scythe Launches One More Chassis with Austere Design

Many customers know Scythe primarily for its delivery of high-end coolers. Nevertheless, the company is gradually extending its assortment by other PC components. Thus, it decided to launch a new brand PC chassis, codenamed Case by Case 3, that will be distributed initially on the internal market. The model is developed in mid-tower form-factor and features classical austere design. Steel casing is totally painted black (from the inside and outside).

Case by Case 3 is able to accommodate motherboards of ATX and micro-ATX standard. As it was mentioned before, the chassis is characterized by austerity in design and absence of any ornamental elements or distracting insertions in framework. The latter features some dedicated accessories for the screwless drive installation.

Internal layout is also estimated for the integration of power supply units of ATX format, four bays for 5.25-inch drives, seven slots for 3.5-inch hard drives or 2.5-inch SSDs. Additionally, the casing …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 30 April 2011, 13:13
Last visit: 30 April 2011, 13:13