Intel is preparing a quad-core Core i7-3740QM, 3840QM and 3940XM

In late September — early October, Intel plans to update the lineup of Core i7 processors on the cores generation Ivy Bridge (22 nm). It is expected that within a few months users will witness the announcement of the CPU for laptops Core i7-3740QM, 3840QM and 3940XM, which will replace released in April 3720QM, 3820QM and 3920XM, respectively.

According to the information from web resources, the trio will receive an increase of 100 MHz from the predecessors, retaining the previous TDP and probably the recommended price. A common feature of the new processors is four x86-cores that handle data in 8 threads (Hyper-Threading).

Core i7-3940XM operates at a nominal frequency of 3 GHz, equipped with 8 MB cache of the third level, two-channel controllers DDR3-1333/1600, graphics subsystem Intel HD 4000. There is support for dynamic overclocking Turbo Boost, Virtualization VT-x and VT-d, new commands AES and instructions AVX. TDP 3940XM is 55 watts.

Core i7-3840QM has almost …

Deepcool Comes Out with Tesseract SW-RD Chassis

Deepcool Industries Co. Ltd. has expanded its production line with a new mid-tower case, entitled Tesseract SW-RD. The chassis features 472x210x454 mm dimensions and weighs 4.97 kg. It is made of galvanized SECC steel plates, boasting a large side acrylic window & black-and-red frontal frame. The top panel houses I/O panel with a pair of USB ports (both 2.0 and 3.0 versions are available) as well as a couple of audio ports.

Deepcool Tesseract SW-RD is compatible with mini-ITX, micro-ATX and ATX motherboards. The layout offers two external 5.25-inch slots, four internal 3.5-inch slots, three internal 2.5-inch slots, and seven slots for PCI expansion cards. All the racks are equipped with slides which facilitate installation of drives without any screws.

To continue, the case is ready to welcome 310-mm-long VGA cards, 168-mm-high CPU coolers as well as standard power supply units. The motherboard tray accommodates a dedicated notch that allows installing the CPU cooler …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 24 November 2012, 17:41
Last visit: 18 July 2013, 21:32