Motherboard Gigabyte Z77MX-D3H TH Review

Each new year brings new ideas for the developers of PC hardware. Since motherboards are indisputably the main component in the PC integration, their design and facilities are given the most attention. Hence, each manufacturer tries to implement some unprecedented technologies to attract potential audience by an improved performance and possibilities. Intel Thunderbolt technology is a hit of 2012; that is why, motherboard designers turned their looks into this direction. Gigabyte was among the first companies to integrate Thunderbolt interface into its products: model Z77MX-D3H TH is a bright evidence of it.


Motherboard Gigabyte Z77MX-D3H TH resembles the modification of its predecessor Z77MX-D3H, except for the availability of Thunderbolt interface and design of PCB. The renunciation of the third PCIe x16 slot allowed the manufacturer to free four lines of PCIe bus and employ Thunderbolt technology for their activation. As a result, a new product has got a …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.

The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.

The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.

Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

AMD Adds Three New Mobile APUs to Kabini Series

AMD has replenished its mobile APU line with three new models of AMD Kabini series: E2-3800, E1-2200 and A4-5100. The triple is developed on Jaguar microarchitecture (28 nm) with SoC design. Needless to say that the new-comers are destined to be incorporated within hand-held mobile devices, such as entry-level laptops and tablets. All of the models are housed in BGA 769 socket cases, thus the customers might expect their market appearance within ready devices.

SoC design stipulates the integration of a one-channel DDR3 controller with the support for two memory modules. In addition, it allows for the enabling of SD, USB 3.0, HD Audio, PCI Express 2.0, LPC, and SATA 6 Gb/sec interfaces. More details about each model are provided below.

AMD E2-3800

This model features 4 cores, operating at 1300 MHz clock frequency. It employs an onboard Radeon HD 8280 graphics chip that runs at 450 MHz. DDR3 controller supports the installation of modules of up to 1600 MHz frequency. The …
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Registered at: 09 June 2012, 13:18
Last visit: 09 June 2012, 13:48