Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Sapphire Announces the Release of New HD 7950 FleX Edition

The market of graphics cards is constantly replenished by new products from established and developing companies. The Sapphire Technology company has made a considerable step in this field and introduced a new graphics card HD 7950 FleX Edition based on Graphics Core Next architecture. This model is distinguished by the capability to connect three monitors with DVI interface simultaneously without the need to use dedicated adaptors. Such welcome option became possible due to the integrated Eyefinity and FleX technologies.



The graphics card enables the connection of 2 monitors with the available DVI ports, and the third monitor – with the HDMI port by means of a special adaptor (that is included in the nominal delivery set). Moreover, HD 7950 FleX Edition is equipped with a couple of Mini DisplayPort video outputs in order to attach additional monitors. Hence, this graphics card will be an optimal solution for gamers who would like to create various configurations.


To …

The Tempered Glass Edition of the Thermaltake Core X71 Chassis

The Thermaltake Company has announced a new Core X71 version of chassis. This solution is called Tempered Glass Edition and is produced in black colour.



One of the novelty’s panels possesses a window out of 4 mm tempered glass instead of the formerly used acrylic panel.


Due to its dual-chamber structure the chassis has much of the inner space, which allows to assemble a PC of almost any complexity with the liquid cooling system utilization.

Motherboards of Mini ITX, Micro ATX and ATX typical sizes can be installed. The maximum number of expansion cards is eight. One can use discrete graphics accelerators of up to 420 mm length.


In the front part of this product, there is enough room to mount a 480 mm heatsink, and it’s possible to install a 360 mm heat dissipator at the top. The preassembled power supply unit length equals to 220 mm.


The dimensions of this full tower chassis by Thermaltake are the following: 677 × 250 × 511 mm.


Unfortunately, the …
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Registered at: 02 October 2012, 22:12
Last visit: 08 December 2012, 01:52