MSI B75IA-E33 - cost-effective Mini-ITX board for processors Ivy Bridge

In early August, it was mentioned about the fact that MSI developer of motherboards is preparing to release three new products in the form factor Mini-ITX on chipsets A85, B75, and Z77. As it turned out, the first low-cost board will be MSI B75IA-E33 — it will start selling in Europe at the end of this week at prices ranging from € 95.



The functionality of this product is limited with respect to the other two models; however, a set of components in B75IA-E33 is very decent. LGA1155 processor socket is energized by three phases (provides additional power to the ATX12V 4-pin), hidden under a small cooler chipset Intel B75. Available one connector PCI Express 3.0 x16, two slots for memory modules DDR3-1066/1333/1600 total up to 16 GB, SATA port 6Gb / s and SATA 3 Gbit / s (3 units) to connect storage devices.


A pair of USB 3.0 on the rear panel are completed with a 19-pin connector on the PCB, through which on the front panel I / O can be taken two SuperSpeed USB. The …

Motherboard ECS Z77H2-A2X (v1.0) Review

The inventory of motherboards designed by ECS is quite ample for the user to get confused. There are various series with a number of models in each, and each of these series is replenishing with new products at enviable frequency. Still, 'Black' series differentiates itself from all other lines by an eye-catching design and remarkable performance. Motherboard ECS Z77H2-A2X is an outstanding representative of 'Black' series that is notable by premium design, premium implementation, and premium performance.



Design and Layout


The first thing that stands out a mile is the delivery box which features goldish coverage and speaks of the motherboard's high-end destination. The board itself is packed in an antistatic box, while all other components found their places in a separate box. This box contains DVD with dedicated software and drivers, user's manual, I/O shield, LucidLogix Virtu MVP Technology usage guideline, a set of plugs for USB and video sockets, six SATA cables with …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 06 October 2012, 12:40
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