Cooler Master Launches High-End Cosmos SE Chassis

Cooler Master, a Taiwanese designer of prime-quality PC hardware, started selling its fresh Cosmos SE (codename COS-5000-KKN1) chassis. The product is developed in mid-tower form-factor and positions itself as a miniature copy of the earlier released Cosmos II full-tower model. The latest entry distinguishes itself by an extraordinary design and an unbelievable capaciousness. The steel and aluminum case has got a totally black coating (interior and exterior); it features 264x569x524 mm dimensions.

The Cosmos SE is delivered in two framework variations: with absolutely blind side panels and with a stylish acrylic window. In order to provide comfort during transportation, Cooler Master has furnished the chassis with convenient carrying handles. The frontal facet is rich in six USB ports (a pair of 3.0 and four 2.0 ports) and in a dedicated button for the fan backlight adjustment.

This chassis model supports standard ATX and even larger motherboards (micro-ATX and E-ATX), as …

GeIL Introduces Memory Module Series Evo Leggera

GeIL has lately introduced a new series of memory modules, codenamed Evo Leggera. According to the words of the manufacturers, this series is ready to demonstrate the utmost performance in combination with the low-profile VELOCE radiators which cannot stop the users from installing huge CPU coolers. Evo Leggera represents an optimal solution and improved functionality in one product. The series includes modules of 1333 MHz to 2800 MHz frequencies compiled in two- and four-channel kits.

Evo Leggera is equipped with advanced low-profile heat dispensers 'Leggera' developed with the implementation of Maximum Thermal Conduction and Dissipation technology. This technology ensures efficient cooling activity with the standard module heights. Memory modules Evo Leggera are compatible practically with all newest logics kits, involving Intel Z77 platform. This expands the versatility of the series.

To continue, it should be mentioned that all models in the series have undergone tough …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 12 March 2012, 20:04
Last visit: 31 March 2012, 14:12