First SSDs from Asus to be Released Already in May

First seen at CES 2013 exhibition, Asus ROG RAIDR solid-state drives are on their final stage of development before an official release in May. Unlike the majority of contemporary SSD solutions in the market, the product from Asus features quite distinct form-factor, similar to expansion cards. The new drive is known to employ PCI Express 2.0 x2 interface with the support of x16/x8/x4 slots.

According to the preliminary data, ROG RAIDR solid-state drives will be available in two capacity variations – 120 GB and 240 GB. Both models will run under a couple of SandForce SF2281 controllers, comprised into RAID 0 array. MLC NAND flash-memory chips from Toshiba (designed under 19 nm technological process) will be the heart of revolutionary SSDs. Irrespective of the overall differentiation, ROG RAIDR will support a range of technologies traditional SSDs support, including S.M.A.R.T., TRIM and NCQ.

With the respect to the performance, both drives will be able to demonstrate …

Galaxy Unveils a Shortened Version of GeForce GTX 760 Adapter

Galaxy Microsystems, a reliable partner of Nvidia, has recently unveiled its own, shortened version of GTX 760 graphics adapter. Codenamed Galaxy GeForce GTX 760 GC Mini, the card employs a reference GK104 GPU (28 nm), but is differentiated by an original PCB and a factory overclocking. The implemented circuit board features 193 mm length dimensions and is elaborated on a blue textolite.

The new-comer is furnished with 1152 CUDA cores that run at 1019 MHz but can be overclocked up to 1084 MHz. Video subsystem is introduced by GDDR5 modules with 256-bit interface. The overall capacity of modules makes up 2 GB. The GDDR5 demonstrates rather striking performance, considering the card’s middle-end destination: the modules are able to gain 6008 MHz clock frequency.

Power supply is organized according to 5+2-phase scheme, where five phases are allotted to GPU. A pair of 6-pin PCI Express Power connectors is used to provide additional power supply to the card. I/O interface …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 06 September 2012, 23:02
Last visit: 08 September 2012, 20:35