Two New SSD Series for Corporate Clients from Samsung

Samsung has recently announced the release of two new SSD series, intended basically for the employment in corporate segment (for servers and large data storages). The first series, codenamed SM843, will be represented by models of 120GB, 240GB and 480GB capacity; the second series, codenamed SM1625, will contain models of 100GB, 200GB, 400GB, and 800GB capacity.



All the models within the series are based on MLC NAND flash-memory, developed under 20 nm technological process. This allowed the company to increase the writing speed index and SSDs durability three times as much, if compared with rival drives and items of the previous generation.


SM843 solid-state drives are designed in 2.5-inch form-factor. They are notable by 28% lower power consumption in active mode and 80% lower retention time. The models employ SATA 3.0 interface and demonstrate the following speed showings: consecutive Read speed achieves the point of 520 Mb/sec, consecutive Write speed equals to 420 …

PowerColor Develops Radeon HD 7850 with Passive Cooling System

PowerColor decided to rouse the curiosity of those customers who would like to enhance their gaming experience by total silence. In contrast to the majority of contemporary gaming graphics adapters which employ powerful, and not infrequently, noisy air-coolers, the new solution from PowerColor, model Radeon HD 7850 SCS3, employs noiseless passive cooling system. Unfortunately, the company does not unveil any data concerning an official presentation, release date or approximate price of the product. Nonetheless, the first online appearance is called to raise positive suspension.



PowerColor Radeon HD 7850 SCS3 will be furnished with a two-slot cooler consisting of several heatsink blocks with a large dissipation area. Those blocks include a range of aluminum plates, joint by a complex heat pipe system. A ramified heat pipe scheme plays a key role here, since it accelerates the transition of heat from GPU to the heatsinks. No other specifications are available so far. Still, the …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …
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Registered at: 27 October 2011, 16:39
Last visit: 27 October 2011, 16:39