The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

SilverStone Updates Its Inventory with Tundra TD02 and TD03 Liquid Coolers

SilverStone Technology, a generally known developer of the whole galaxy of hardware components, decided to resume with its Tundra liquid cooling solutions, by introducing two new products. Codenamed Tundra TD02 and Tundra TD03, these coolers were first showcased at CeBIT 2013 exhibition in March. Potential customers will be attracted by the absence of necessity for maintenance and refill, as well as by enhanced durability.



Both coolers have got in their framework disposition a waterblock with a copper base and an integrated pump, which are embraced by a nickel-plated aluminum case. As distinct from plastic waterblocks supplied by competitors, the product from SilverStone offers a striking reliability, combined with easy installation, due to the availability of a dedicated mounting bracket.


The framework also consists of two connecting hoses, an aluminum heatsink, and a pair of 120 mm white fans. The models are differentiated only by heatsink dimensions: Tundra TD02 …
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Registered at: 03 August 2012, 21:34
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