Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Telum and Ferrum: the Continuators of Aerocool Templarius Genus

Aerocool proudly introduces two new PC cases that have been entitled as Templarius Telum and Templarius Ferrum. As seen from the titles, the novices continue Aerocool's Templarius chassis line and are called to become their worthy representatives. Both models are appropriate for the mounting of gaming computers and other powerful systems. Moreover, they are already on sale, so gamers and other enthusiasts can taste all their benefits in real time.



PC cases Telum and Ferrum are developed in full-tower ATX form-factor. Their dimensions, 420x185x435 mm and 460x200x455 mm correspondingly, promote for the installation of truly voluminous and mighty components: CPU coolers up to 158 mm in height and graphics adapters up to 400 mm in length. Internal framework allows the user to create a really efficient cooling environment, providing room for up to ten fans. Besides, the chassis are equipped with dedicated holes for the water-cooling organization; all tubes and a heatsink can be …

Lian Li to Release a Space-Saving PC-Q33 Chassis

Lian Li, a well-known hardware manufacturer from Taiwan, is ready to marvel the audience by one more offbeat PC case: the PC-Q33. The model is developed in a space-saving mini-ITX standard with 229x328x240 mm dimensions. Despite frugal size, an overall case capacity equals to 29.2 liters. This chassis features a quite laconic design, although will be available in two coating variations: black and silver. The implementation of a lock on the frontal panel is thought to be the model’s basic peculiarity.



The PC-Q33 is consistent with mini-ITX and mini-DTX motherboards and supports the installation of 220 mm graphics cards, as well as 180 mm CPU coolers. At the same time, the maximal length of the power supply unit should not be more than 200 mm. Internal layout presupposes the mounting of three 2.5-inch drives and a couple of 3.5-inch drives.


PCI Expansion slots are available in the amount of two only. The frontal panel accommodates two high-speed USB ports (3.0 v) and 3.5 mm …
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Registered at: 30 August 2012, 21:08
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