Intel Compute Stick With Intel Apollo Lake CPU

In the year of 2015 the Intel Company announced a mini PC with a completely new layout, named Intel Compute Stick. According to its dimensions it resembles a mobile 3G adapter or a slightly enlarged typical flash drive, though its functionality lets us consider this sample to be a fully-featured PC, which only needs to be connected to the monitor or TV-set through the HDMI interface.



At first the Intel Company and its partners released their versions with Intel Bay Trail CPUs, being later exchanged by the Intel Cherry Trail series solutions. In 2016 even more powerful models with Intel Core m3 and Intel Core m5 (Intel Skylake) CPUs appeared. One can expect, that in the second quarter of 2017 the Intel Compute Stick manufacturers will use the Intel Apollo Lake series chips.


At least two new Intel Compute Stick versions are to be released. The first model will feature 2 GB of RAM, 32 GB of ROM eMMC memory and the pre-set 64-bit Windows 10 Home OS. The second version will …

New Voluminous External SSDs with Thunderbolt Ports from LaCie

Demands of customers towards external SSD solutions are even tougher than towards traditional built-in drives. This is primarily explained by the aesthetic considerations, and secondly, by the space taken by the device. LaCie has recently announced the release of two external SSD models which are differentiated by an extraordinary design. The upcoming drives are codenamed LaCie Little Big Disk Thunderbolt and will be delivered in two capacity variations: 512 GB and 1 TB. Last year the manufacturer introduced a similar model line but with smaller capacity (up to 240 GB) and different interface (SATA II).



New LaCie LittleBig Disk Thunderbolt drives feature SATA III interface and are based on two 2.5-inch SSDs. Those drives might be combined into different RAID configurations (RAID 0, 1). Upon the whole, the models are housed in ultramodern aluminum casing which serves two purposes: aesthetic and practical. Their design can be described as stylish and refined, while the casing …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 17 April 2011, 01:37
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