Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

SilverStone Updates Its Inventory with Tundra TD02 and TD03 Liquid Coolers

SilverStone Technology, a generally known developer of the whole galaxy of hardware components, decided to resume with its Tundra liquid cooling solutions, by introducing two new products. Codenamed Tundra TD02 and Tundra TD03, these coolers were first showcased at CeBIT 2013 exhibition in March. Potential customers will be attracted by the absence of necessity for maintenance and refill, as well as by enhanced durability.



Both coolers have got in their framework disposition a waterblock with a copper base and an integrated pump, which are embraced by a nickel-plated aluminum case. As distinct from plastic waterblocks supplied by competitors, the product from SilverStone offers a striking reliability, combined with easy installation, due to the availability of a dedicated mounting bracket.


The framework also consists of two connecting hoses, an aluminum heatsink, and a pair of 120 mm white fans. The models are differentiated only by heatsink dimensions: Tundra TD02 …

MSI Announces Z170A PC Mate Mainboard

MSI has recently habituated to launching ever newer and more efficient mainboards. This time the company unveils Z170A PC Mate full ATX model that draws power via 24-pin ATX and 8-pin EPS sockets. It is based on Intel Z170 chipset and is estimated for Intel Core LGA1151 (Skylake) CPUs. The core cooperates closely with DDR4 3300 MHz memory (4 slots are available, two-channel mode), the maximal volume of which might achieve 64 GB.



MSI Z170A PC Mate comes equipped with 6-phase VRM system. The model is rich in expansion facilities: it offers one PCI Express 3.0 x16, one PCI Express 3.0 x4, three PCI Express 3.0 x1, and a pair of PCI slots. The connection of drives is realized due to 1x M.2 slot 32 Gb/sec, 1x SATA Express 16 Gb/sec, and 6x SATA III 6 Gb/sec.


As far as interfaces are concerned, this motherboard houses six USB 3.0 ports, four USB 2.0 ports, a couple of USB 3.1 ports, as well as three different video ports: HDMI 2.0, D-Sub and DVI. Besides, network connection …
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