Urban S21: a New Mid-Tower Case from Thermaltake

Thermaltake Technology introduces a new PC case codenamed Urban S21. This is a regular mid-tower chassis with, as usual, high-quality framework and wide spectrum of destinations. Urban S21 is developed in a minimalistic design with all black coverage (external and internal) and little detailing. The model is housed in a steel casing (SECC) and contains a single transparent side window. Its overall dimensions equal to 438x185x497 mm.

This PC case is expected to accommodate motherboards of ATX and micro-ATX standard, CPU coolers of up to 155 mm in height, and graphics cards which length does not exceed the admissible 320 mm. The layout offers seven PCI expansion cards, three external 5.25-inch drive bays, one external 3.5-inch drive bay, and five internal bays for the integration of 3.5/2.5-inch drives.

Urban S21 is equipped with a frontal interface panel that is represented by a pair of USB 3.0 ports and a pair of 3.5 mm audio slots. The top panel contains handy ‘Power’ …

Sharkoon Showcases Small-Sized QB ONE PC Chassis

Sharkoon Technologies GmbH come out in the European market with a new extraordinary PC chassis, entitled QB ONE. The model features 368x225x180 mm dimensions, ready to welcome mini-ITX mainboards. The layout offers two PCI expansion slots, two bays for 5.25-inch drives and three 3.5-/2.5-inch ones (all are installed without tools).

Sharkoon QB ONE is targeting graphics cards as long as 315 mm, PSUs (ATX & SFX) of 145 mm in length, CPU coolers as high as 150 mm, and heatsinks of 145 mm in height. Connectivity options include four USB ports (2x 3.0 version and 2x 2.0 version) and two audio ports. One of the most outstanding features pertained to the framework is a smart arrangement of all controls; this enables dual case positioning: horizontal and vertical.

This chassis boasts an optimized ventilation system. Hence, it is equipped with one pre-installed 120 mm fan on the top panel; additionally, it’s possible to mount one more top fan, one 80 mm fan on the rear panel, …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 02 January 2012, 10:58
Last visit: 24 June 2012, 17:55