Velox V55 and Slim S55: Two New SSD Series from Silicon Power

Silicon Power, a well-known developer of flash-memory drives, as well as HHD and DRAM, has replenished its inventory with two new SSD series, codenamed Velox V55 and Slim S55. All the models included into the lineups are traditionally designed in 2.5-inch form-factor. Both series will be represented in the market by three models of 60 GB, 120 GB and 240 GB capacity. Their major advantage over rival products lies in acceleration of all operations connected with upload, speed boosting and general performance. Therefore, these SSDs are just perfect for ‘highly-demanding’ users.

Velox V55 solid-state drives are housed in resistant cases made of polished aluminum. All three models feature identical dimensions: 100x70x9 mm and weigh 79 g. The drives are based on SandForce controller and employ SATA III (6 Gb/sec) interface. The maximal sequential speed index claimed by the developer approximates 550 Mb/sec on reading operations and 470 Mb/sec on writing operations. Velox V55 …

A New Series of Haswell-Based Gigabyte Brix Mini-PCs

The appearance of Brix mini-PCs last spring was Gigabyte’s debut in this market segment. The first products were elaborated specifically for Intel Ivy Bridge processors. However, the company decided to update the line of ultra-compact PCs with four new models. Entitled GB-BXCE-2955, GB-BXi7-4500, GB-BXi5-4200, and GB-BXi3-4010, the products are characterized by the support of power-efficient Intel Haswell CPUs.

The most efficient model is Gigabyte GB-BXi7-4500 with the integrated Intel Core i7-4500U processor (1.8/3.0 GHz), whereas the least efficient turns to be Gigabyte GB-BXCE-2955, based on Intel Celeron 2955U (1.4 GHz). At the same time, Gigabyte GB-BXi5-4200 is equipped with Intel Core i5-4200U CPU (1.6/2.6 GHz) and Gigabyte GB-BXi3-4010 comes with Intel Corei3-4010U solution (1.7 GHz).

Except for diverse CPUs, all four Brix mini-PCs feature practically analogous specifications:

— dimensions: 114.4x107.6x29.9 mm;

— memory: two DIMM slots, support for 16 …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 10 February 2012, 19:19
Last visit: 10 June 2012, 08:25