Zalman Divulges Basic Specifications of PSU GoldRock XG Series

Zalman, a recognized manufacturer of cooling systems, PC enclosures and other hardware units, is going to replenish its lineup of products with a high-end PSU series. Codenamed GoldRock XG, the series will be represented by three models of 550W, 650W and 750W power efficiency, ZM550-XG, ZM650-XG, and ZM750-XG correspondingly. The preliminary data demonstrates that all models are equipped with high-level components which allow the product to gain 80 Plus Gold certificate standard. Moreover, Zalman claims that its new PSUs will comply with EPS12V v2.92 and ATX12V v2.3 standards.

GoldRock XG power supply units will be distinguished by high efficiency index that will fluctuate within the measures of 88% to 92%. All the models will be released with the implementation of heat-resistant capacitors with solid and liquid insulator. The series will also boast the integration of LLC topology and DC-DC converter. The latter will ensure the utmost reliability and profitability of the …

Foxconn Q77M: Effective Solution of Corporate Tasks

Foxconn introduces a new motherboard destined for the efficient solution of all basic corporate assignments. Codenamed Foxconn Q77M, the model is developed in micro-ATX form factor and supports processors from Intel: Sandy Bridge and Ivy Bridge (Intel Core i3, i5, i7 of the second and third generations). It is peculiar for the integrated facilities pertained to the remote control and virtualization.

Motherboard Foxconn Q77M employs high-quality Japanese capacitors in its framework. The minimal error-free operational time is estimated at sixty thousand hours. Such index is going to attract those corporate clients who require stable and uninterrupted work with the utmost performance.

This model accommodates such video interfaces as VGA, HDMI, DisplayPort, and DVI, gigabit LAN socket, six-channel HD audio codec and graphics core with DirectX 11 support. Additionally, the board allows employing up to 32GB of DDR3-1600 MHz memory type and supports RAID standards with the …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.

The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.

Thereby, the cooler from Thermalright has got C-shape framework …
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Registered at: 12 November 2012, 12:03
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