Universal CPU Cooler Scythe Mugen 4 Review

Some hardware pieces disappear after a while of emergence but some serve PC needs for years, always appearing in new incarnations. The latter is true about Mugen series of CPU coolers from Scythe. The success of the very first model, Scythe Mugen, gave rise to the appearance of an updated second version, then the third one, and, finally, the fourth one – Scythe Mugen 4. This cooler is distinguished initially by its universality, supporting all actual CPU sockets (Intel- and AMD-based). For sure, this is not the mere advantage, since it is able to offer much more.

Delivery Kit

Mugen 4 is delivered in a compact-size cardbox, containing a large amount of information about the cooler. The contents will give a buzz to all consumers, due to a list of useful components. Here one might find: a brand mounting kit Hyper Precision Mounting System (H.P.M.S.) that includes a kit of screws, plastic gaskets, a metallic backplate, mounting plates, a clamping plate, four wiry clinches for …

Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.

Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.

The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.

Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 08 May 2011, 08:09
Last visit: 08 May 2011, 08:09