Lian Li PC-B12 - Aluminum chassis for silence devotees

Lian Li engineers have decided to diversify the range of branded chassis with “quiet” PC-B12. This Mid-Tower model is designed in such a way as to minimize the noise coming from the system unit. To do this, the anterior wall of the chassis is made solid and in construction added the cover for the rear fan, included damping pad for hard drives and fans, as well as 'soft' feet, on which the hull stands.

Lian Li PC-B12 is currently available only in black version. Its dimensions are 498 (L) x 210 (W) x 472 (H) mm, weight — 6.4 kg. Inside can be placed the motherboard form factor ATX or microATX, a maximum of 8 cards PCI-E expansion up to 360 mm, the CPU cooler up to 160 mm, power supply, three hard disk format 3.5 «and one 2.5». The pair of «external» 5.25-inch bays should as well be considered.

New model doesn’t have vent on the front panel; it is migrated to the lower bound of the chassis and serves two 140 mm fan located opposite basket for storage. Blow-out …

Intel Intros 525 SSD Series for High-Performance Systems

Intel replenishes its SSD product line with 525 series that is distinguished by utmost facilities and power-saving properties. Intel 525 embraces six models of 30GB, 60GB, 90GB, 120GB, 180GB, and 240GB capacity that are predestined to be employed in high-performance systems. Due to compact dimensions (3.7x50.8x29.85 mm), these solid-state drives are appropriate for handheld small-sized devices, such as ultrabooks, tablets, all-in-one solutions, and embedded systems. According to Intel's developers, the models are eight times smaller in size than traditional HDDs of 2.5-inch form-factor.

Intel 525 are known to employ mSATA interface with PCI Express mini-slot. All models are based on a multi-level NAND flash-memory developed under 25 nm technology. The drives support 128-bit encryption technology that takes Advanced Encryption Standard as the background; this standard functions as an additional data security means in case of loss or theft.

To continue, new SSD series from …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 05 April 2011, 08:43
Last visit: 05 April 2011, 08:43