Arctic Cooling Intros Two Modifications of Freezer CPU Cooler

Arctic Cooling AG, a well-known Swiss developer of cooling solutions, has recently introduced its newest CPU cooler, Freezer, in two modifications: i11 and A11. Both versions have got tower-like framework, featuring 108x90x130 mm dimensions. The Freezer i11 is compatible with Intel LGA 2011/1156/1155/1150 socket platforms, whereas its companion is intended for AMD Socket FM1, FM2, AM3, AM3+, AM2, and AM2+. To say more, this pair is able to cool down the ‘blaze’ of CPUs with 150 W TDP.



Arctic Freezer i11/A11 consists of an aluminum heatspreader with forty-five plates, three U-shape copper heatpipes, and one 92 mm fan. The heatpipes are thought to support direct contact technology that dramatically improves heat transfer process.


The implemented fan is developed on a fluid dynamic bearing and is equipped with a PWM controller. The latter assures that the blades could change their rotational speed within the ranges from 500 RPM to 2000 RPM. Herein, the maximal airflow …

ASRock Announces a New Mini-ITX Motherboard AD2550-ITX

ASRock, a well-known supplier of high-quality PC hardware, tries not to leave chances to its competitors in the development of new products and their delivery to potential customers. Hence, the company has recently announced the release of a new mini-ITX motherboard AD2550-ITX, intended for the incorporation into small-sized systems. As seen from the codename, the model employs dual-core Intel Atom D2550 processor, running at 1.86 GHz. It should be pointed out that AD2550-ITX resembles its predecessor AD2550B-ITX, launched last year, although the new-comer is differentiated by a more qualitative configuration.



The motherboard is based on black PCB that boasts the implementation of solid-state capacitors only. All key functional facilities are ensured by means of Intel NM10 Express chipset. The board houses a pair of 204-contact SO-DIMM slots which support DDR3-1066 MHz memory modules of up to 4 GB overall capacity. A couple of SATA 3 Gb/sec ports (for the connection of drives) …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 11 November 2012, 22:23
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