Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

ECS Develops Haswell-Compatible Motherboard Z87H3-A2X Extreme

At the cusp of an official release of Intel’s fourth generation processors each hardware designer tries to elaborate new Haswell-compatible components. Motherboard manufacturers are probably the ones to introduce the lion’s share of such products. ECS is not an exception. According to the data provided by a reputable source, ECS is soon going to release its newest prime-class board codenamed Z87H3-A2X Extreme. The first meeting with the new-comer is planned within the boundaries of Computex 2013 exhibition taking place in June.



As seen from the codename, ECS Z87H3-A2X Extreme is based on Intel Z87 Express chipset covered by a black-and-red heatsink. The model employs full-sized printed circuit board, Socket LGA1150, and 12-phase VRM for CPU power supply with gold-plate solid-state capacitors. Power subsystem elements are cooled down by a voluminous CoolTech V heatsink. This heatsink is connected with a chipset one by means of a nickel-plated copper heat pipe.


To …

Kingmax to Amaze the Customers with mSATA MMP20 SSD

Solid-state drives with mSATA interface have become an efficient tool for the improvement of laptops and nettops performance. Kingmax has joined the ranges of companies that develop SSD technologies in mSATA form-factor. Its fresh model line, MMP20, is primarily targeted at the small form-factor systems and hybrid solutions like HDD+SSD. The SSD model line features ‘Premium Selected’ certificate and has undergone thorough testing challenges.



Kingmax mSATA MMP20 is a compact and effective solution not only for laptops and desktop systems, but also for embedded systems like tablets. Kingmax SSDs comply with JEDEC MO-300B requirements and have SATAII 3 Gb/sec interface. They are furnished with a controller which optimizes the memory monitoring to ensure the most appropriate performance and reliability. SATA interface is called to align the connection between the flash-memory and host-system; this is supposed to improve data reading and writing speed, OS and applications …
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