Meet a Pair of High-Efficiency M6 and M.2 SSDs from Plextor

Plextor, an established data storage manufacturer from Japan, announces the release of two new solid-state drive series – the M6 and the M.2. Both new-comers are marked by some outstanding efficiency facilities and completely new design. The M6 SSDs are developed in 2.5-inch design but are housed in ultrathin aluminum cases of 5 mm depth only. They are based on Marvell 88SS9187 controller and MLC NAND flash-memory of Toggle type (19 nm technological process).

The M6 drives feature high-speed SATA III 6 Gb/sec interface and support Plextor TrueSpeed technology. It should be noted that these SSDs are thought to support up to 1 GB RAM – DDR2-800 or DDR3-800 — used as cache. With the attempt to satisfy the needs of diverse customer audiences, Plextor is going to release the M6 modifications: M6 Pro models for high-performance tasks and M6S for ordinary users.

To continue, the M.2 solid-state drives are designed in a totally new NGFF form-factor (New Generation Form …

Apacer to Release DDR3 Memory Modules of Armor Series

About a month ago Apacer Technology announced the release of new DDR3 memory modules to replenish Armor series. Codenamed Apacer Armor DDR3, these modules are chiefly targeting overclockers and inveterate gamers who long for the high-speed performance in various environments. Good news for all Apacer's customers is that the release of these outstanding products is scheduled for the mid January, 2013.

Modules Armor DDR3 consist of heatsinks which resemble 'armor', while the series itself is represented by the items of various colors, including red, yellow, blue, and black versions. This way the customer will be able to select the most suitable module to correspond to the overall chassis and motherboard color gamma. The heatsinks feature quite typical dimensions and this automatically eliminates all problems connected with the installation of voluminous CPU coolers.

The implemented printed circuit board is given black coverage in combination with eye-catching yellow, blue …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 27 October 2012, 13:36
Last visit: 27 October 2012, 17:59