G.Skill Showcases New RAM Memory Modules TridentX DDR3

Long-awaited Computex 2013 has brought to light the whole galaxy of innovative hardware ideas. RAM market has also replenished with new entries, partially due to G.Skill International. Its new RAM modules, codenamed TridentX DDR3, are an embodiment of utmost performance, reliability and compatibility. The new-comers have been developed to support the latest Intel’s Haswell-based CPUs i3/i5/i7, integrated into Intel Z87 Express chipset.

TridentX DDR3 are introduced by sets of two and four 240-contact DIMM modules, the total capacity of which achieves 8 GB, 16 GB and 32 GB. All of them are equipped with original in design heatspreaders. They are also known to support Intel XMP overclocking profiles and to operate at 1.65 V power voltage.

Detailed Specifications

TridentX DDR3-3000 modules will be available in 4x8 GB kits (32 GB). Their effective frequency showings make up 3000 MHz with 12-14-14-35 latencies.

TridentX DDR3-2933 modules will be available in 2x4 …

Qualcomm Unveils Snapdragon 425, 435 & 625 Mobile CPUs

Qualcomm has added three new mobile processors to its Snapdragon lineup. The Snapdragon 425, 436 and 625 boast improved functional, higher level of performance as well as longer-time of off-line operation for tablets & smartphones. The triplet entails 4/8 ARM Cortex-A53 CPU cores which run at 1.4 GHz (425, 435)/ 2.0 GHz (625 model) frequency.

The least efficient CPU is Qualcomm Snapdragon 425. It’s equipped with Qualcomm Adreno 308 graphics core and shows compatibility with eMMC 5.2 drive, LPDDR-667 MHz RAM, 16-megapixel cameras of 1280x720 resolution. Qualcomm Snapdragon 435 accommodates a more efficient Adreno 505 graphics core. It is able to cooperate with LPDDR3-800 MHz memory, internal eMMC 5.1 drives as well as external SD 3.0 memory cards.

In its turn, Qualcomm Snapdragon 625 is thought to be the most powerful CPU in the series. It is based according to 14-nm technological process and Adreno 506 GPU. This model can work with LPDDR3-933 MHz RAM and 24-megapixel …

FSP Intros ‘Noiseless’ PSU Model Aurum Xilenser 500

FSP, a renowned developer and supplier of power supply units, introduces a new product that is widely recognized as ‘noiseless’ PSU. Codenamed FSP Aurum Xilenser 500 (AU-500FLD), it employs a passive cooling system instead of an air cooler, thus its dump operation is easily explainable. The unit also characterizes by a startling efficiency which provided for the acceptance of 80+ Gold certificate.

Aurum Xilenser 500 takes similar to Aurum Pro/CM models design with a totally black casing and a comb-like top grid enclosed in a golden stripe. The model is able to operate at the nominal 500W power and support the latest ATX12V/EPS12V standards. It should be noted that this unit utilizes a standard framework with all power connectors soldered on the printed circuit board. A set of connectors involves five SATA connectors, a single 4-contact FDD, four 4-contact Molex, and a pair of 6+2-contact PCI Express connectors. Naturally, it contains two main 24-contact and 4+4-contact …
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Registered at: 02 September 2012, 22:08
Last visit: 02 September 2012, 22:38