New CPU Cooler for Small-Sized PCs from Thermalright

Thermalright boasts the release of a new CPU cooler AXP-100. The new arrival is targeting small-sized PC systems, featuring 121x105.5x58 mm dimensions. Similar to other items that take responsibility for proper CPU cooling, this model is able to provide an efficient heat extraction from processor surface and its surrounding crucial components. It is compatible with the majority of AMD and Intel sockets to guarantee its universal utilization. Hence, it supports AMD FM1, FM2, AM2, AM2+, AM3, AM3+, and Intel LGA (2011, 1366, 1156, 1155, 775) platforms.



Thermalright decided not to apply the so popular nowadays 'direct contact' technology, implying the direct contact of CPU cover with heat pipes. Instead, the cooler's framework has been given a bit different approach.


Model AXP-100 consists of a copper, nickel-plated base, six copper heat pipes, a set of aluminum ribs located parallel to the motherboard, and an atypical in its nature fan TY-100. The heatpipes spring from the …

MSI Z77A-GD65 - Common LGA1155-board by Micro-Star Company

Like the other major motherboard manufacturers, the company Micro-Star Intel thoroughly prepared for the appearance of Ivy Bridge processors and new chipsets of seventh series. Motherboard companies use simple and understandable system of names, that is why it is not difficult to arrange in order of seniority, all six motherboards based on the logic of Intel Z77 Express, from the main MSI Z77A-GD80 to younger Z77A-G43 and the small Z77MA-G45.



The box, in which comes motherboard MSI Z77A-GD65 is traditionally designed. The front side is decorated with different logos and the centre has a large poster. On the reverse side of the box there is a summary of some advantages and features of the board.


One of the characteristic weaknesses about motherboards of Micro-Star Company is the lack of panels to display USB 3.0 ports on the front wall of the chassis. The layout of the motherboard MSI Z77A-GD65 is close to the classical, and therefore it not only looks good, but is easy to …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 05 August 2011, 11:35
Last visit: 05 August 2011, 11:35