‘Extraordinary’ Design of Flash Drive Kingmax UI-05

The market of flash drives is full of offers from multiple designers, however Kingmax company surpassed all competitors by introducing an ‘extraordinary’ product. This singularity basically consists in a drive’s design: the part of the casing is transparent, and this enables the user to watch over the work of an internal flash-memory chip through the glass window. No other company dared for such an experiment so far and the drive is supposed to become a real hit in the market.

Kingmax UI-05 has got a metallic streamline casing which serves a solid shield for the memory chip and other electronics. The transparent glass window is lighted up by the blue LED that indicates the drive’s operational mode. The flash drive has USB 3.0 socket and is based on the Chip-on-Board technology where the memory chip is fixed directly at the circuit board. It goes in 4, 8, 16, and 32 GB volume capacity to satisfy the needs of any customer.

Kindmax UI-05 developers stressed out that …

Corsair Launches Graphite 760T Chassis with a Half-Transparent Panel

Corsair has just started the sales of its newest Full-Tower chassis, entitled Graphite 760T. The new entry features 567x246x564 mm dimensions and is available in two color variations: black and white. The most remarkable peculiarity ascribed to the model is a half-transparent side panel, fixed by special loops. Such framework allows for the integration of system components with a striking design and might become a real attraction in home environment.

Corsair Gpaphite 760T is thought to accommodate motherboards of ATX, E-ATX, Flex-ATX, XL-ATX, and SSI-CEB standard. Its internal layout houses nine PCI expansion slots, three 5.25-inch drive bays, and six 3.5-inch or 2.5-inch drives. I/O panel, located on the top facet, contains a pair of standard 3.5 mm audio sockets and four USB ports (2x 3.0 version, 2x 2.0 version).

To continue, the chassis comes with a well-considered cable management system, where each cable has its own place. Cooling system is represented by two onboard …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 19 March 2012, 15:11
Last visit: 19 March 2012, 15:11