BitFenix Offers Neos Chassis in 6 Color Variations

BitFenix Design Lab announces the release of a new PC chassis entitled Neos. Its major attraction is the availability of six different color versions of enclosures. Moreover, some of the models come with an acrylic window on the side panel but the others have a blind facet. Upon the whole, Neos boasts a durable steel case of 470x185x429 mm dimensions, featuring mid-tower form-factor.



BitFenix Neos is intended to support motherboards of ATX, micro-ATX and mini-ITX standard. The layout offers a couple of external 5.25-inch drive seats, three internal 3.5-inch drive seats, as well as three internal 2.5-inch drive seats. Expansion facilities are maintained by means of seven PCI expansion slots. It should be noted that the chassis’ layout presumes individual placement of bays for the drives, dedicated screwless mounting for ODD, and special apertures for cable management.


All the models are equipped with a single pre-installed rear fan of 120 mm dimensional type. In addition, …

Enermax Unveils Ostrog ADV Chassis with Off-Beat Backlight

Enermax has designed a new PC case, targeting demanding customers. The Ostrog ADV is differentiated from all rival chassis by the implementation of a brand MaxBriteTM LED Technology backlight. It ensures bright and even illumination along the outline of the case. Enermax offers models with three colors of backlight (green, red & blue) which can operate in six different modes (All on, Off, Flash, Sparkle, Vegas, Dimmed).



The new-comer is developed in a mid-tower form-factor, featuring 516x493x215 mm dimensions. The layout is estimated for the mounting of mini-ITX/micro-ATX/ATX motherboards with the maximum of 7 expansion slots. There is a possibility to install quite long videocards (up to 414 mm), standard ATX PS/2 power supply units, and a quite high CPU cooler (up to 174 mm).


Enermax Ostrog ADV is able to accommodate three external 5.25-inch drives as well as six internal 3.5-/2.5-inch drives. Cooling is ensured by a set of pre-installed/optional air fans. A pair of …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 03 February 2012, 09:55
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