ECS Develops Haswell-Compatible Motherboard Z87H3-A2X Extreme

At the cusp of an official release of Intel’s fourth generation processors each hardware designer tries to elaborate new Haswell-compatible components. Motherboard manufacturers are probably the ones to introduce the lion’s share of such products. ECS is not an exception. According to the data provided by a reputable source, ECS is soon going to release its newest prime-class board codenamed Z87H3-A2X Extreme. The first meeting with the new-comer is planned within the boundaries of Computex 2013 exhibition taking place in June.



As seen from the codename, ECS Z87H3-A2X Extreme is based on Intel Z87 Express chipset covered by a black-and-red heatsink. The model employs full-sized printed circuit board, Socket LGA1150, and 12-phase VRM for CPU power supply with gold-plate solid-state capacitors. Power subsystem elements are cooled down by a voluminous CoolTech V heatsink. This heatsink is connected with a chipset one by means of a nickel-plated copper heat pipe.


To …

Buffalo Announces HD-PCFU3-C Wearables

Buffalo Technology is about to release its newest line of wearable hard drives. Codenamed HD-PCFU3-C, the products will be available in three capacity versions: 500 GB, 1 TB, and 2 TB. All of them allow as pure black so pure white exterior design. The models will be backed by 1 year limited warranty.



The Buffalo HD-PCFU3-C external HDs are housed in solid aluminum cases and equipped with a high-speed USB 3.0 interface. The latter might be used both for data transfer as well as charge-in purposes; put it otherwise, the user will be saved from the necessity to buy an additional AC adaptor.


Pricewise, the cheapest solutions are 500 GB HD-PCF500U3-BC and HD-PCF500U3-WC with the price tag of $90. The HD-PCF1.0U3-BWC and HD-PCF1.0U3-BBC of 1 TB capacity will cost about $110, whereas their senior companions, the PCF2.0U3-GBC and HD-PCF2.0U3-GWC of 2 TB capacity, will go as high as $165. Shipping is to start in early January 2015.

Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.



Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.


Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …
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