Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Aerocool Cruisestar Advance Case Overview

Many manufacturers of budget-friendly PC cases adore expanding their line-up by a banal change of the plastic case kit without dramatic changes in the filling or framing structure of the chassis. The Aerocool Company is also saddening with this approach, although, for the sake of justice, it is worth noting that in recent years this has happened quite rarely. Nevertheless, the subject of today's review – the Cruisestar Advance is just the result of a change in appearance based on the simplest PGS-V series frames. Let’s see what the consequences of this metamorphosis from the point of view of the ordinary buyer are.


Features

Case type: Midi-Tower

Dimensions, mm: 483 (H) x 200 (W) x 441 (D)

Material: ABS plastic, steel

Weight, kg: 3,5

Color: black

Form factor: ATX

Devices 5.25": 1

3.5" external devices: –

3.5"/2.5" internal devices: 3/2

Supported number of expansion slots: 7

Front fans: 1 x 120 mm (installed)

Rear …

Air Cooler Thermalright Archon SB-E Review

Thermalright Inc. has managed to design and supply a whole galaxy of cooling solutions for the entire period of its existence. The prototype of the cooler codenamed Thermalright Archon SB-E was announced last spring and its original version has reached the market this autumn. This model is characterized by some outstanding efficiency and noise level showings, as well as high compatibility with diverse platforms.



General Peculiarities


This air cooler is delivered in a traditional for this manufacturer cardbox. The box contains the cooler itself and a set of key components, featuring a universal backplate, a set of screws, a screwer, fan frames, and brand thermal compound — Thermalright The ChillFactor III. Archon SB-E features 175x155x79.5 mm dimensions and weighs 940 g. It is compatible with Intel and AMD platforms and supports sockets LGA 775/1155/1156/1366/2011 (Intel) and 939/FM1/FM2/AM2/AM2+/AM3/AM3+ (AMD).


Framework


The implemented heatsink accommodates …
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Registered at: 01 July 2012, 16:01
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