Scythe SCIOR-1000: a Comprehensive CPU Cooler with Top-Flow Design

Scythe is going to start the sales of its newest CPU cooler, entitled SCIOR-1000. It is honored for a comprehensive nature, since it might work with all contemporary CPUs, except for Intel Socket LGA2011 models. The other remarkable thing ascribed to the product is the employment of Top-Flow design.

Therein, the fan is localized over the heatsink, directing the airflow towards the whole framework, including the nickel-plated base. This way, it promotes for a better cooling effect.

Scythe SCIOR-1000 embraces also three 6 mm heat-pipes, along with a 100 mm fan. The latter supports PWM technology, so is able to reach the speed of 1800 RPM. The maximal noise level achieves 26.7 dB. Release date is scheduled for the final days of 2013. Some other specifications about the cooler are described below:

— framework dimensions: 136x117x107 mm, weight – 400 g.;

— supported platforms: Intel – LGA1366/115x/775 and AMD – FM1/FM2/AM2/AM2+/AM3/AM3+;

— heat-pipes: …

PSU Chieftec BPS-650C2 Review

Chieftec, a renowned manufacturer of power supply units, has recently introduced a series of new PSUs, codenamed BPS, which included five different models. The two models differ from other items in color, dimensions, applied fans, and belonging to the lower PSU segment. The other three products belong to the high-end segment and own outstanding characteristics. Chieftec BPS-650C2 belongs to the high-end echelon that is confirmed as by its internal integration, so by general specifications.


PSU Chieftec BPS-650C2 employs modular system of cable connection and is notable by 650W of output power. The external design of the model did not outlive any dramatic changes, except for the availability of large stickers on the PSU casing. Quite the contrary, the integration has been given a completely new touch. BPS-650C2 is based on a new advanced platform developed by CWT. The manufacturer employed DC-DC converters for +3.3VDC and+5VDC channels. Those converters are …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 11 October 2012, 22:35
Last visit: 11 October 2012, 22:35