Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.

Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.

All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

ASRock Showcases H61M-VG4 Motherboard for Ivy Bridge Processors

In spite of the commotion incited by the upcoming release of Intel Haswell processors and the growth of products compatible with their technical requirements, Intel Ivy Bridge CPUs will continue their existence in the market for some time more. For the nonce, ASRock has elaborated a new micro-ATX motherboard, codenamed H61M-VG4. The newly-designed product is based on Intel H61 Express chipset with Socket LGA1155, supporting Intel Ivy Bridge/Sandy Bridge processor lines. According to ASRock, all potential customers will be able to receive quite efficient system for a budget price.

ASRock H61M-VG4 is furnished with two DIMM slots which support two-channel DDR3 memory modules of up to 16 GB capacity, running at 1066 MHz, 1333 MHz and 1600 MHz frequencies. Expansion facilities are realized by means of a single PCI Express 3.0 x16 slot and a single PCI Express 2.0 x1 slot. The connection of optical, hard and solid-state drives becomes possible thanks to the availability of four SATA …
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Registered at: 09 March 2012, 16:12
Last visit: 09 March 2012, 16:42