Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …

Meet Small-Sized QC5000M Mainboard from ASRock

ASRock enters the mainboard market with a new micro-ATX solution, entitled QC5000M. The greenhorn takes Kabini platform as the basis, featuring AMD A4-5000 hybrid processor (28 nm) with 4 Jaguar cores and 1.5 GHz clock frequency. The APU is accompanied by two slots for one-channel DDR3-1600 MHz RAM (up to 32 GB) and an integrated AMD Radeon HD 8330 graphics (500 MHz clock frequency, compatibility with DirectX 11.1 standard).

The implemented APU boasts 15 W TDP only, requiring a small-sized heatsink for efficient cooling. The model takes power via 24-pin ATX connector and is based on AMD A68 chipset. It is equipped with a single PCI Express 2.0 x16 slot, a pair of PCI Express 2.0 x1 slots, and the same amount of SATA III 6 Gb/sec ports.

Network and audio facilities are represented by Realtek RTL8111GR Gigabit Ethernet controller and 7.1-channel Realtek ALC887 codec respectively. Additionally, the PCB is furnished with ELNA sound capacitors. The rear side of the motherboard …

Release of Low-Profile Cooler Slim Silence A-Plus from Gelid

Gelid Solutions, a Hong-Kong based renowned manufacturer of thermal solutions and other PC hardware, has lately presented its low-profile CPU cooler, codenamed Slim Silence A-Plus, for AMD platform. The new cooler is compatible with AMD AM2(+), AM3(+), as well as, FM1. According to the words of the Asian manufacturer, this model is capable to manage processors with the TDP index fluctuating in the measures of 95W.

There is one peculiar feature about Slim Silence A-Plus: its design resembles the design of coolers destined for GPU due to the foveate fan. That is why, customers can sometimes confuse this cooler's destination.

CPU cooler Slim Silence A-Plus goes in rather compact dimensions; its height does not exceed 28 mm, while its weight equals to 282 g. Such compactness provides for its unimpeded installation into chassis of different form-factor, starting from Mid-Tower, and finishing with Mini-ATX, 1U and HTPC.

The cooler's casing consists of an aluminum radiator …
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Registered at: 17 October 2012, 16:46
Last visit: 18 October 2012, 22:22