Thecus Company introduced a new naming scheme for products

Company Thecus decided to introduce a new naming scheme for its drives, so that users can easily understand its product line. New names will have all future models.

In the name with length of five to seven characters will be encoded some information about the device. The first letter indicates the type of device: N — NAS running Linux, D — DAS, W — NAS running Windows, V — NVR. This is followed by a two-digit number indicating the number of disks (compartments for storage) in the system. If this amount is less than 10, the first zero is omitted. Fourth and fifth digit is coded by the hardware platform used. For example, 21 — Cavium Econa, 31 — Marvell Armada, 51 — Intel Atom Cedarview, 52 — Intel EvanSport, 53 — Intel Atom third-generation, 81 — Sandy Bridge, 82 — Ivy Bridge, 83 — Other Platforms future generations. On the sixth position, which is reserved for future needs, zero is registered. If the system is performed in rack format, the model name is …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …

Xigmatek Intros New CPU Cooler Gaia II

Xigmatek, an outstanding manufacturer of cutting-edge PC components, announces the release of a new CPU cooler, entitled Gaia II. The model is developed in accordance with a traditional tower-like framework and might be truly called a universal cooling solution. It supports a large variety of platforms for processors with TDP level of not higher than 150 W: Intel Socket LGA 775/1366/1156 and AMD Socket AM2(+)/AM3(+)/FM2/FM1.

Cooler Gaia II is designed with the direct implementation of H.D.T. technology (Heat Pipe Direct Touch). This implies that all three copper heatpipes, which stem from the heatsink base, come into direct contact with the CPU surface. The heatpipes themselves have got U-shape structure and 8 mm dimensions. They pierce ‘multi-plate’ aluminum heatsink to provide for a better heat dissipation.

The model is delivered with a pre-installed 120 mm fan with bright orange blades; it is fixed to one of the heatsink sides and housed in a black frame. The fan is …
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Registered at: 09 January 2012, 12:28
Last visit: 09 January 2012, 12:28