Greeting Asus Maximus VI Formula Gaming Motherboard

Asus is going to put on sale its newest LGA1150 motherboard of ROG (Republic of Gamers) series, entitled Maximus VI Formula. The board features ATX form-factor and is based on Intel Z87 chipset that supports all Haswell-based Intel Core processors. The most peculiar thing about the new-comer is the availability of ROG Armor enclosure that covers the PCB on both sides. The top cover is made of ABS; it prevents the heat produced by the surrounding components (i.e. graphics adapters) from warming up the CPU and VRM systems. The rear cover is made of SECC steel that stops the PCB from bending.



Motherboard Maximus VI Formula houses four DIMM slots that support up to 32 GB dual-channel DDR3 memory modules with up to 3100 O.C MHz frequencies. 8-channel VRM system consists of NexFET transistors, Black Wing throttles, and high-efficiency solid-state capacitors. All power components are cooled down by a dedicated heatsink that is a part of a liquid-cooling system. This motherboard model …

ViewSonic Outs XG03 Gaming Monitors

ViewSonic has enlarged its lineup of gaming products with another series of monitors – the XG03. The lineup currently consists of two models: XG2703 & XG2703-GS. The key differentiation between them lies in the support for AMD FreeSync (the first model) and Nvidia G-Sync (the second model). Consequently, the GX2703 employs red accents in design, whereas the XG2703-GS uses green detailing.



ViewSonic XG03 is based on 27-inch SuperClear IPS panel, featuring 2560x1440 pixels & 165 Hz refresh rate. The display boasts 16:9 aspect ratio, 178/178 degrees viewing angles, 1000:1 static contrast, 120M:1 dynamic contrast, 300 cd/m2 maximal brightness as well as 4 ms response time.


The abovementioned parameters refer to the XG2703-GS model that is already on sale (estimated price — $699.99). The other model will be released in the nearest future.


The models are thought to be equipped with a pair of 2-watt speakers, 100x100 mm VESA bracket, a couple of USB 3.0 ports, the same …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 01 February 2012, 20:59
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