Greeting Versa H23 and H23 Window Cases from Thermaltake

Budget-oriented series of PC cases from Thermaltake has been replenished with two new models: Versa H23 and Versa H23 Window. The mere difference between the two enclosures is the availability of a side-faceted acrylic window in ‘Window’ version. Still, both mid-towers feature 429x209x491 mm dimensions and come with a totally black coating. Their internal spacing is sufficient to include standard ATX, as well as contracted micro-ATX motherboards.



Thermaltake Versa H23 and H23 Window boast two 5.25-inch, six 2.5-inch and three 3.5-inch trays for the installation of various drives. All of them might be mounted without any special tools, due to a polished clipping system. The cases offer seven PCI slots to expand the system’s functional.


Additionally, the models support the installation of CPU coolers of up to 156 mm in height, graphics cards of up to 315 mm in length, and a standard PS/2 power supply unit. The I/O panel is located in the top-front panel. It embraces …

Intel Intros 525 SSD Series for High-Performance Systems

Intel replenishes its SSD product line with 525 series that is distinguished by utmost facilities and power-saving properties. Intel 525 embraces six models of 30GB, 60GB, 90GB, 120GB, 180GB, and 240GB capacity that are predestined to be employed in high-performance systems. Due to compact dimensions (3.7x50.8x29.85 mm), these solid-state drives are appropriate for handheld small-sized devices, such as ultrabooks, tablets, all-in-one solutions, and embedded systems. According to Intel's developers, the models are eight times smaller in size than traditional HDDs of 2.5-inch form-factor.



Intel 525 are known to employ mSATA interface with PCI Express mini-slot. All models are based on a multi-level NAND flash-memory developed under 25 nm technology. The drives support 128-bit encryption technology that takes Advanced Encryption Standard as the background; this standard functions as an additional data security means in case of loss or theft.


To continue, new SSD series from …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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Registered at: 16 November 2012, 16:16
Last visit: 16 November 2012, 16:29