ASMedia to Introduce USB 3.5 Controllers in 2014

ASMedia, an auspicious designer of PCIe bridges, USB 3.0 controllers and Switch IC items, announces the development of a new USB 3.5 controller. According to the preliminary information, this controller is going to support 10 Gb/sec data transfer speed, which is nearly twice higher than current USB 3.0. Earlier the launch of an advanced component was scheduled for late 2014, however, now the company is intended to officially introduce it early next year.

The decision to elaborate a speedier controller is explained by ASMedia in two ways. Firstly, the company is currently receiving more orders from motherboard manufacturers for the development of USB 3.0 hubs, due to the recent launch of Intel Haswell CPUs. Nonetheless, an enforcement of platform will sooner or later require an enforcement of various facilities, including connectivity and data transfer.

Secondly, USB 3.5 is called to rival Thunderbolt interface. It should be stressed that both interfaces feature analogous …

Meeting New Chassis Sugo SG10 from SilverStone

SilverStone Technology, a celebrated Taiwanese PC hardware manufacturer, is going to release at the end of the current month its new mini-tower chassis codenamed SG10 that joined the SilverStone Sugo series. Featuring 354x295x220 mm dimensions, the novice is housed in a case made of stainless steel (totally black exterior and interior) with an aluminum frontal facet. The latter comprises a ventilation slot, covered by an anti-dust grid.

First of all, it should be noted that Sugo SG10 is predestined specifically for the assembling of small-sized but rather high-performance PC systems. The chassis is compatible with motherboards of mini-ITX/micro-ATX standard and is ready to welcome graphics adapters of up to 338 mm (length), PSUs of 180 mm (length), as well as CPU coolers of up to 165 mm (height). One of its key peculiarities is the localization of the power supply unit at the frontal part of the case, if compared with the majority of contemporary solutions with PSU bays at the …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 02 August 2012, 06:28
Last visit: 02 August 2012, 06:28