Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Transcend to Announce a SuperSpeed USB 3.0 SSD

Transcend Information, a leading designer of storage solutions, announces the launch of its new super high-speed SSD, codenamed ESD200. The drive employs the latest USB 3.0 interface of SuperSpeed generation and is distinguished by truly compact dimensions, providing for the most convenient utilization. The casing is void of movable parts and operates with minimum noise level. Besides, it's based on a set of flash chips and owns anti-heat, shockproof and anti-vibratory properties. The series will be introduced by models of 128GB and 256GB volume capacity.



The implementation of SuperSpeed USB 3.0 interface ensures ten times faster data transfer speed, if compared with the previous USB 2.0 generation. On such conditions, Transcend ESD200 is capable to develop Read speed up to 260 Mb/sec and Write speed up to 225 Mb/sec. This implies that 4.7GB DVD drive full of different content will be copied for fifteen seconds only. However, a new SSD is backwards compatible with USB 2.0; so, …

ASRock Launches a New Motherboard with Intel SBA Support

ASRock announces the launch of a new budget-priced motherboard B75M-DGS R2.0. The model does not differentiate itself by an attractive design or wide overclocking facilities, as far as its main predestination is a stable operation in large corporate networks. The board is known to support Intel Small Business Advantage (SBA) software applet that optimizes PC operation and increases its performance. Despite such promising commodities, its price doesn't go over $60 per unit.



ASRock B75M-DGS R2.0 is designed in micro-ATX form-factor; this limits the number of supported expansion slots and other interfaces. As seen from the codename, the motherboard is based on Intel B75 system logics and shows compatibility with Intel Celeron, Intel Pentium and Intel Core i3/i5/i7 processors (second and third generation) compatible with Socket LGA1155. Memory subsystem consists of two DIMM slots which support two-channel DDR3-2200 MHz modules, the overall capacity of which might achieve 16GB …
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Registered at: 29 July 2011, 13:55
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