Foxconn Introduces a Set of Motherboards for Intel Haswell Processors

Foxconn announces the release of several new motherboards, based on Intel H87 and B85 chipsets. The set consists of four models – B85MX, B85MX-D, H87MX, H87MX-D – compatible with the fourth generation Intel Core processors for Socket LGA 1150. The quad is intended for the assembling of small-sized mATX PCs, such as multifunctional office engines or powerful home multimedia centers.



The most outstanding peculiarities pertained to the new motherboards from Foxconn are seen in the support of PCI Express 3.0 bus with the bandwidth of 10 Gb/sec. The interface of the new generation allows integrating the most efficient graphics cards (and other peripherals) by means of dedicated PCIe sockets. Connectivity is supported due to dedicated SATA III ports and USB 3.0 ports.


The boards might accommodate up to 32 GB of DDR3 memory with clock frequencies up to 1600 MHz. The availability of an advanced Realtek audio controller ensures the production of a pure 5.1-channel sounding. …

A Low-profile SilverStone NT08-115XP Cooling System

Nowadays compact systems are becoming more widespread, thus increasing the popularity of low-profile cooling systems. Specifically for such systems, the SilverStone Company has designed a low-profile air cooling system under the NT08-115XP codename.



NT08-115XP is announced to be an alternative to a standard cooler out of the CPU supply kit. The manufacturer states, that this cooling system is able to disseminate up to 65 W of heat, so it’s not effective enough to chill down powerfull CPUs.


The dimensions of the SilverStone NT08-115XP cooling system are the following: 101 x 101 x 33 mm. It possesses an aluminum heatsink with a copper center hub. The rotary speed of the 80 mm fan (10 mm thick) is in the range of 1200–3400 rpm, producing an air flow of 5.64–15.98 CFM (9.58–27.15 m3/hr) and a noise level of 16.5–28.98 dBA.


This specialty is compatible with Intel LGA 115x sockets only.


The price has not been voiced yet.

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …
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Registered at: 07 July 2011, 14:30
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