Lian Li PC-B12 - Aluminum chassis for silence devotees

Lian Li engineers have decided to diversify the range of branded chassis with “quiet” PC-B12. This Mid-Tower model is designed in such a way as to minimize the noise coming from the system unit. To do this, the anterior wall of the chassis is made solid and in construction added the cover for the rear fan, included damping pad for hard drives and fans, as well as 'soft' feet, on which the hull stands.



Lian Li PC-B12 is currently available only in black version. Its dimensions are 498 (L) x 210 (W) x 472 (H) mm, weight — 6.4 kg. Inside can be placed the motherboard form factor ATX or microATX, a maximum of 8 cards PCI-E expansion up to 360 mm, the CPU cooler up to 160 mm, power supply, three hard disk format 3.5 «and one 2.5». The pair of «external» 5.25-inch bays should as well be considered.


New model doesn’t have vent on the front panel; it is migrated to the lower bound of the chassis and serves two 140 mm fan located opposite basket for storage. Blow-out …

HP Elite Slice & Pavilion Wave: a Pair of Extraordinary Mini-PCs

Within the framework of IFA 2016, HP has introduced a pair of stylish mini-PCs. The HP Elite Slice and the HP Pavilion Wave boast an astounding exterior design as well as a holistic internal filling. The new-comers differ from each other in a number of ways, starting from the OS and finishing with the hardware base.



Therefore, business-oriented HP Elite Slice features 165x165x35 mm dimensions & weighs 1.04 kg. It’s based on Intel Core Skylake CPU and up to 32 GB of DDR4 RAM. The model comes with an integrated graphics core, Gigabit Ethernet & Wi-Fi adapters. Connectivity options are represented by a single USB 3.1 Type-C port, a pair of USB 2.0 ports, one DC-in, one RJ-45, one DisplayPort, and one HDMI port.


If there is a need, the user is free to connect additional modules: HP ODD, HP VESA (wall mount) or HP Audio. The latter comes with inbuilt speakers Bang & Olufsen, which ensure 360-degree sounding, and a couple of microphones with HP Noise Cancellation support. …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 15 May 2011, 14:35
Last visit: 14 November 2011, 03:33