Thermaltake to Release a New Urban Chassis: Urban R31

Thermaltake Technology has just annunciated the release of yet another representative of Urban series: Urban R31. The chassis features mid-tower form-factor with 511x206x490 mm dimensions. It might boast a minimalist design concept with totally black coating, steel case, and aluminum frontal facet. The company offers the model in two framework variations: with an onboard side window and with a blind side facet. Unfortunately, there is no news so far concerning the pricing and an exact release date.



Thermaltake Urban R31 is ready to accommodate ATX or micro-ATX motherboards. Its internal layout comprises three 5.25-inch drive bays, six 3.5-inch drive bays, and one 2.5-inch drive bay. In addition, the chassis comes with a built-in dock-station on the top facet, ready to house one more 3.5/2.5-inch drive. Closer to the rear facet one can find seven PCI expansion slots.


To continue, spacing within the case allows for the integration of rather lengthy graphics cards (up to 410 …

PowerColor Intros New Graphics Card with Fling Force Cooler

TUL Corporation, in the framework of its PowerColor brand, introduces a new graphics card with quite an original way of air cooling organization. The new-coming adapter, codenamed PowerColor Radeon HD 7850 Fling Force, employs 'two-storied' cooler of an unusual structure. Along with an aluminum heatsink, copper heat pipes, and a voluminous fan, the manufacturer implemented non-monolithic fan ribs. Their tips are fixed to the main part in a way to change their location relative to the plain of rotation.



On conditions of low rotational speed, tips of the ribs are located at approximately 80 degrees angle relative to the graphics card. On conditions of heightened speed, the ribs become more linear; this way, the impeller diameter enlarges from 92 mm to 95 mm. Such structural approach to the fan framework develops into an improved performance and air cooling effect.


The model is based on Pitcairn chip, developed on Graphics Core Next architecture under 28 nm technological …

ARM Readies Cortex-A72 and Mali-T880 for Mobile Devices

ARM has just announced a series of solutions for the upcoming next-generation mobile SoC. The most notable developments are Cortex-A72 processor and Mali-T880 graphics. According to the manufacturer, both components will be interconnected within SoC by means of CoreLink – CCI-500. The launch of new items is scheduled for 2016. Rockchip, MediaTek and HiSilicon are among the companies to integrate both elaborations into their products.



It should be noted that Cortex- A72 is a successor of Cortex-A57, taking analogous 64-bit operations but demonstrating three times higher performance. The new-comer will be designed under 16 nm FinFET+ technological process. Its layout corresponds to big.LITTLE framework requirements; this promotes for its combination with other ARM cores.


As far as Mali-T880 GPU is concerned, it provides for 1.8 response time increase if compared with the Mali-T760 model. Herewith, its power consumption is reduced by 40%. Moreover, this GPU might support 4K …
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Registered at: 21 October 2011, 19:13
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